IC backend house ASE Technology Holding's newly-developed fan-out panel-level packaging (FOPLP) technology has obtained orders from HiSilicon, according to sources familiar with the matter. Save my ...

TSMC, Micron, and ASE are working on getting deals to secure old display panel plants in Taiwan, and convert them to CoWoS advanced semiconductor packaging facilities to meet the unstoppable AI GPU ...

BAYAN LEPAS, Malaysia--(BUSINESS WIRE)-- ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and testing capabilities in the Bayan ...

Earnings Call Insights: ASE Technology Holding Co., Ltd. (NYSE:ASX) Q4 2024 Consolidated revenues grew 2% year-over-year in 2024, with ATM revenues increasing 3%. Advanced packaging and testing ...

TAIPEI, Feb 13 (Reuters) - ASE Technology Holding Co.(3711.TW), opens new tab, the world's largest chip packaging and testing provider, said on Thursday it expects its revenue from leading-edge ...

Fraunhofer is moving forward with the next phase of its consortium to develop technologies for panel-level packaging. In 2016, Fraunhofer launched the original effort, dubbed the Panel Level Packaging ...

Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holding Co., Ltd. TAIEX: 3711, NYSE: ASX) today officially launched its fifth plant in Penang, Malaysia. The new plant will ...

Consolidated revenues grew 2% year-over-year in 2024, with ATM revenues increasing 3%. Advanced packaging and testing revenues surged to $600M, up from $250M in 2023, driven by strong demand in ...