Nova (NasdaqGS:NVMI) has had its WMC platform selected as the tool of record by a global foundry customer for advanced ...

While much has been said about advanced packaging in the context of Malaysia's semiconductor sector, little is actually known ...

Asahi Kasei opens new slitting facility in Taiwan to boost semiconductor packaging materials production amid rising AI demand ...

Lam Research is highlighting its advanced packaging business as a key growth driver, with the company projecting revenues from this segment to rise more than 50% in 2026. The push is linked to demand ...

Camtek sells the cameras and measuring tools that let chipmakers confirm advanced packages are built correctly, and that job has become mission-critical as the industry stacks memory and logic ...

TAICHUNG, Taiwan (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...

Applied Materials (AMAT) held a master class event this week, and much of the focus was on the company's positioning in dynamic random access memory and advanced packaging, Wall Street analysts said.

In a new report from Ctee, we're learning that demand for TSMC's advanced packaging "remains high" and that rumors across the semiconductor supply chain suggest TSMC plans to consider setting up CoWoS ...

As artificial intelligence pushes semiconductor performance to new limits, chipmakers are increasingly turning to advanced packaging to overcome challenges that traditional chip design alone can no ...

Amid rising domestic demand for semiconductors fueled by the rapid expansion of AI, China’s ...

Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level... Test Research, ...