The SG-BGA-6103 chip socket allows socketing of 0.8-mm-pitch 189-ball BGA/CSP JEDEC MO-207 ICs without performance loss. The 6.5-GHz socket supports stacked BGA devices having conductive elastomer ...
The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...
Ironwood Electronics announced the release of its high performance socket that allows 0.65mm pitch, 14x17mm body, 20X25 array 500 ball BGA package to be placed in socket and operated without ...
Greenliant has recently announced the release of its NVMe NANDrive BGA SSDs, a new line of solid-state drives designed to endure the harshest environments while delivering exceptional performance.
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