Mini LED chips can measure as small as 50μm × 100μm, with pad spacing as narrow as 5-50μm, demanding extreme precision in ...

This application note provides an in-depth discussion of the soldering process and how it relates to leaded LED lamps and display components, with the objective of serving as a guide to achieving high ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP,” a line-up of LED packages which ...

A high-density dc-dc converter can deliver substantial power, but only if excessive heat is removed by transferring internal heat through a number of material interfaces to a surface exposed to the ...

LED lighting, or solid-state lighting (SSL) offers advantages in energy consumption and feature capabilities over conventional lighting sources, but requires careful attention to the capabilities and ...