This application note provides an in-depth discussion of the soldering process and how it relates to leaded LED lamps and display components, with the objective of serving as a guide to achieving high ...
Mini LED chips can measure as small as 50μm × 100μm, with pad spacing as narrow as 5-50μm, demanding extreme precision in solder paste printing. Through technological innovation, Fitech enables its ...
Samsung Electronics introduced a full line-up of chip-scale LED packages (CSP), including 0.6-W-class and 3-W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages. Samsung’s CSP technology ...
Most engineers are quite familiar with typical low-power-indicator LEDs, whether they be surface-mount or the classical through-hole packages. All that's needed to use them is a voltage source and a ...
A high-density dc-dc converter can deliver substantial power, but only if excessive heat is removed by transferring internal heat through a number of material interfaces to a surface exposed to the ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP,” a line-up of LED packages which ...
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