SAN JOSE, Calif.--(BUSINESS WIRE)--Spectra7 Microsystems Inc. (TSX:SEV) (“Spectra7” or the “Company”), a leading provider of high-performance analog semiconductor products for broadband connectivity ...
“We are thrilled to partner with FIT, a recognized global manufacturing leader in high-speed cables and connectors, to clearly establish e-Tube technology as the forefront interconnect for future ...
SAN JOSE, Calif. — (TSX-V:SEV) Spectra7 Microsystems Inc. (“Spectra7” or the “Company”), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, today ...
Electromigration and resistivity present serious obstacles to interconnect scaling, as previously discussed. In a copper damascene process, grain growth is constrained by the narrow trenches into ...
Newswise — Researchers at Rensselaer Polytechnic Institute have created a road map that brings academia and the semiconductor industry one step closer to realizing carbon nanotube interconnects, and ...
As leading chipmakers continue to scale finFETs — and soon nanosheet transistors — to ever-tighter pitches, the smallest metal lines eventually will become untenable using copper with its liner and ...
An integrated circuit at 0.25-micron design rules contains about 800 meters of wire interconnect, draining 50 percent of the power consumed by the circuit. When 0.01-micron chips emerge, they will ...
Electromigration (EM) remains a critical reliability challenge in modern microelectronic systems, particularly as device miniaturisation and increased current densities intensify the phenomenon. In ...
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