Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
SAN MATEO, Calif. — ChipPAC Inc. is about to roll out an inexpensive low-inductance flip-chip package that promises to bring the package now associated with high-performance processors into broader ...
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