As IC speeds continue to climb well into the gigahertz range, system designers are finding that the new obstacles they must overcome to interconnect ICs to packages and packages to printed-circuit ...

Santa Clara, Calif. — As chip designers, Kaushik Sheth and Egino Sarto struggled to fit silicon into cost-effective packages. Now they're trying to convince other chip designers to adopt a ...

Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services “We are pleased to collaborate with Cadence, a leader in electronic design software, ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

Greater functionality, performance, and speed are in great demand in pervasive computing, RF, and automotive electronic systems, as well as most everything else. Complexity continues to skyrocket, ...

A recently developed software tool automatically checks for design-rule violations as locations are designated for wire bonds between die and package lead frames. Known as the Post-Layout Bond Tool, ...

The modern world runs on integrated circuits (ICs). From smartphones and cars to AI data centers, medical equipment, satellites, and industrial automation systems, semiconductor chips are the ...

TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog post. The latest ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

MEYREUIL, France & SAN JOSE, Calif.--(BUSINESS WIRE)--Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a ...