A large lot of plastic-packaged ICs is on its way to surface-mounting. The components have passed electrical inspection, where those having functional defects were removed. They have passed optical ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

A key element of Mitsubishi’s new forged molding compound (FMC) carbon fiber-reinforced SMC is the use of low-flow (but not low-pressure) compression molding, which ...

Chopped prepreg molding compound (CPMC), a relatively new material form resembling molding compounds made from chopped resin impregnated tow, provides design and processing engineers various benefits ...

Compression molding involves forming of complex shaped components by molding of a charge of fiber reinforced prepreg bulk molding compound (BMC) under heat and high pressures. Unidirectional fiber ...

An MCAM customer wanted to replace metal injection molded (MIM) magnesium with a composite on a performance mountain bike’s suspension elements with the goals of reducing mass and avoiding processing ...