A laser-induced thermocompression bonding technique developed by researchers at Wuhan University enables the bonding of Cu nanowires with a diameter of 200 nm to Au pads. Published in the ...

DUBLIN--(BUSINESS WIRE)--The "Interface Market Tracker" report has been added to ResearchAndMarkets.com's offering. The interface market includes analog and digital interconnect. This year, we are ...

Even though nanometric CMOS technologies allow integrating several hardware resources into a single chip (SoC), a lot of difficulties arise for the on-chip interconnection. Classical physical issues ...

With increasing numbers of CPU cores, multimedia subsystems and communication IPs in today’s System-on-Chips, the main SoC interconnects, crossbars or networks-on-chip fabrics become key components ...

The need for higher bandwidth with efficient connectivity increases as hyperscale data centers transition to faster, flatter, and more scalable network architectures, such as the 2-tier leaf-spine, as ...

Interconnects are becoming much more problematic as devices shrink and the amount of data being moved around a system continues to rise. This limitation has shown up several times in the past, and ...

As overall bandwidth throughput increases, selecting the right chip-to-chip interface becomes critical for such systems as switches, routers, etc. So far, Optical Internetworking Forum's (OIF) System ...

As more electronic subsystems populated automobiles over the years, engineers discovered the necessity of interconnecting them with serial data networks to minimize wiring and optimize their ...

A broad portfolio of interface specifications from the MIPI Alliance enables design engineers to efficiently interconnect essential components in a mobile device, from the modem and antenna to the ...

Intel says its work on switching from copper I/O to optical fiber has taken a big step forward in high-speed data transmission. At this year's Optical Fiber Communication Conference in San Francisco, ...