It is the world’s best diffusion barrier that prevents oxidation and metal migration in circuits. My fusion process is the only process in the world that can use 2D Graphene for circuit interconnects ...

Researchers began working on 3D integrated circuits almost two decades ago. In the first efforts, each stack, which contained a device layer and multiple interconnect layers, was fabricated separately ...

Researchers at the Interuniversity Microelectronics Centre (Leuven, Belgium) and Ghent University (Ghent, Belgium) recently designed and fabricated elastic interconnections that can be stretched ...

Researchers in electrical and computer engineering at University of California, Santa Barbara have introduced and modeled an integrated circuit design scheme in which transistors and interconnects are ...

Researchers at Intel Corp. today announced they have made some noteworthy progress in the area of integrated silicon photonics, paving the way for faster networking between processors. Intel Labs ...

Researchers have developed new polymer materials that are ideal for making the optical links necessary to connect chip-based photonic components with board-level circuits or optical fibers. These ...

Taking advantage of the speed of light is one of the goals of the Photonics in the Package for Extreme Scalability (PIPES) program managed by the Defense Advanced Research Projects Agency (DARPA).

You’re probably familiar with the little black boxes nestled neatly inside your favorite devices. With their diminutive size and unassuming characteristics, it can be hard to believe these vessels are ...