The objective of this course is to introduce graduate and senior undergraduate students to advanced topics in linear elasticity. Students will build on the knowledge gained through all mechanics ...
The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...
The objective of this course is to introduce graduate and senior undergraduate students to advanced topics in linear elasticity. Students will build on the knowledge gained through all mechanics ...
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