Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...

For years, many have predicted the end of flash memory scaling, particularly NAND, but the technology continues to defy the odds as it moves down the process curve. Still, there are signs that the ...

Micron Technology recently unveiled 176-layer, triple-level-cell (TLC), 3D NAND flash memory with a 30% smaller die size that employs a new replacement-gate (RG) NAND technology. The chips offer a 35% ...

This is going to be a column that’s divided into three sections. It’s based on a question that a student posed in the EEWeb forums, and he also sent it directly to yours truly. The core of this ...