Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

This application note focuses on printed circuit board (PCB) layout considerations for QFN and DQFN packages. This is intended for users who are familiar with PCB design, as well as, signal integrity ...

Mentor Graphics has unveiled the Xpedition Package Integrator, a tool which is said to coordinate and optimise the product design process from integrated circuit to PCB. Mentor Graphics has unveiled ...

Cadence has upgraded its Allegro and OrCAD pcb packages. The latest releases are said to bring significant new benefits, including the ability to miniaturise end product footprint and a reduction in ...

This paper presents a reference design flow for solving the electrical, thermal and mechanical challenges of a printed circuit board (PCB) using simulation tools from ANSYS. This approach can be ...

If you’ve spent any time at all laying out your own circuit boards we’re sure you’ve run into the issue of not having the right component or package available in the standard libraries. If it’s a ...

Nepes, which makes semiconductor packages, has developed a new technology that does away with printed circuit boards (PCBs), which are currently in short supply around the world. Its “nepes System in ...