Fig 1. The die pad in Texas Instruments’ PowerPAD supports the die during fabrication, thus serving as a good thermal heat path to remove the heat away from the chip. Fig 2. TI’s PowerStack 3D ...
Moving air with spinning blades is the most popular way, but it is not the only way. Using the PCB actuator technology he has been working on for the past few years, [Carl Bugeja] built a small ...
Sapphire’s HD 7990 Atomic graphics card was revealed at Computex 2013 earlier this year and we took a look at the early version of it. The PCB has now been pictured and as you can see it features a ...
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