In recent years, gallium nitride (GaN) has emerged as a compelling candidate to complement the silicon material used in wireless communication and power conversion applications. Benefits of GaN ...

LOWELL, Mass.--(BUSINESS WIRE)--M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, today announced the industry’s first ...

“The fabrication of integrated circuits (ICs) employing two-dimensional (2D) materials is a major goal of semiconductor industry for the next decade, as it may allow the extension of the Moore’s law, ...

Since the days of pioneers like Marconi and Armstrong, radio has fascinated countless numbers of engineers. Wireless technology has evolved from the days of bulky, power-hungry vacuum tubes to today’s ...

ShellCase Ltd. (Jerusalem, Israel) and Tower Semiconductor Ltd. (Midgal Haemek, Israel) have announced a formal agreement for the joint development of wafer-level chip scale package solutions for ...

Design of CMOS digital integrated circuits, concentrating on device, circuit, and architectural issues. Analysis and design techniques in custom integrated circuit design, standard cells, memory. Use ...

Almost since the inception of MEMS, the idea of integrating MEMS devices with CMOS circuits has been a grand goal and a subject of much discussion in the industry. In fact, one of the driving forces ...

Fig 1. A typical CMOS input circuit comprises a “P” and “N” transistor. One is fully “on” for logic high, and the other is “on” for a logic low. Fig 2. When a CMOS input pin is at logic high or low ...

The packaged device comprises of a common leg circuit which includes digital attenuators, phase shifters, a low noise receive chain, and a transmit driver amplifier, as well as a CMOS logic driver.