Plasma etching is perhaps the most essential process in semiconductor manufacturing, and possibly the most complex of all fab operations next to photolithography. Nearly half of all fab steps rely on ...
Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...
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Joint research validates new semiconductor etching process, achieving five times speed improvement
A collaborative research team from Nagoya University and Tokyo Electron Miyagi Ltd. has demonstrated that the company's new ...
In this interview, AZoM talks to Bas Derksema about advancements in plasma etching and deposition processes for compound semiconductor materials applications. Please could you introduce yourself and ...
What is Atomic Layer Etching? Atomic layer etching (ALE) is a highly controlled and selective etching technique that removes material layer by layer at the atomic scale. It is a cyclic process that ...
AZoMaterials interviews Matt Wilding about how the EP-Replayer enables users to simulate previous etch runs in real time, helping them optimize End Point detection methods, and more. Can you start by ...
Mass spectrometry, by contrast, is a powerful technique for the analysis of any process gas. Careful consideration of differences in pressure, reaction time scales and process flow is essential for ...
An example of directional etching for nanohole arrays of less than 500nm in diameter. (Image: A*STAR Institute of Materials Research and Engineering) Wet etching can be classified into two main types ...
The process comprises a surface nitrogenation step via N + ion bombardment, followed by O 2 plasma treatment to form volatile etching byproducts. This approach enables subatomic-level etching ...
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