For many years, system-in-package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased ...

The impatient and hungry mobile electronics market is fueling the need for system packaging technologies as an interim solution before the inevitable transition to system-on-chip methodologies. While ...

System-in-a-package technology fulfills the need for high-density, small-footprint products with short turnaround times by using low-cost, standard assembly equipment. Shorter development times and ...