DUBLIN--(BUSINESS WIRE)--The "2018 Future Of Global SMD, COB, CSP LED Packaging Markets to 2025 - Growth Opportunities, Competition And Outlook Of packaging and applications Across End User Industries ...

Fairchild Semiconductor's Motion-SPM™ in 29 x 12mm SMD Packaging Optimizes Energy Efficiency and Board Space in Low-Power Inverter Motor Designs Fairchild Semiconductor introduces the FSB50325S (250V) ...

Nexperia’s GaN FET devices, featuring next-gen high-voltage GaN HEMT technology in proprietary copper-clip CCPAK surface mount packaging, are now available to designers of industrial and renewable ...

Laser Tek, a major supplier of SMD (surface-mount-device) packaging materials and semiconductor equipment in Taiwan, yesterday announced that it will enter back-end production for passive components.

According to Murata, its latest ultrasound sensor could well be the first to come in a surface-mount SMD package. According to Murata, its latest ultrasound sensor could well be the first to come in a ...

Bourns, Inc. announced the introduction of new high Power TVS diode models in SMD packaging for use in AC and DC power line applications. The new models feature high current bidirectional port ...

Fairchild Semiconductor's Motion-SPM™ in 29 x 12mm SMD Packaging Optimizes Energy Efficiency and Board Space in Low-Power Inverter Motor Designs Fairchild Semiconductor has introduced the FSB50325S ...