SAN DIEGO, Nov. 24, 2020 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH) ("GBT”, or the “Company”), announced as continuance update to its press release from October 29, 2020, that its 3D ...

Flexible three-dimensional integrated circuits (3D ICs) enable high-density interconnects, miniaturization, and multifunctionality. Unlike rigid circuits, flexible 3D ICs can conform to various ...

(Nanowerk News) Scientists from the Flexible 3D-System Integration Laboratory at Osaka University developed a new method for the direct three-dimensional bonding of copper electrodes using silver, ...

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...

The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...

A graphical representation of a stack of individual chips connected by through-silicon vias (TSVs). (Image courtesy of IBM) Three-dimensional integrated circuits (3D-ICs) help to increase power and ...

Ioannis Savidis is an Associate Professor at Drexel University, where he is Director of the Integrated Circuits and Electronics (ICE) Design and Analysis Laboratory. He received the B.S.E. degree in ...

Semiconductor technology continues to deliver higher levels of logic density in the era of nanometer processes. System-on-chip (SoC) teams can deliver even higher functionality when coupled with the ...