Silicon carbide (SiC) wafers have attracted attention as a material for advanced power semiconductor device applications due to their high bandgap and stability at high temperatures and voltages.

FREMONT, Calif.–Lam Research Corp. here today introduced a new platen for its 200-mm wafer chemical mechanical planarization (CMP) system designed to extend reliable control of polishing processes ...

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...

Grenoble, France. Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the industry’s first ...

This will expand the role of advanced CMP consumables, high-precision metrology, and contamination control. Epi wafers gain strategic value As device architectures become more demanding, epi quality ...

SAN LUIS OBISPO, Calif., July 6, 2023 /PRNewswire/ -- Revasum today announced the availability of 200mm SiC wafer polishing capability on their 6EZ chemical mechanical polishing platform. The 6EZ has ...

Chemical mechanical polishing (CMP) is a process of global planarization that leverages the synergetic effect of chemical reactions and mechanical abrasion to facilitate wafer polishing. CMP has ...