EDN

Lam says new platen controls CMP processes within 2 mm of wafer’s edge

FREMONT, Calif.–Lam Research Corp. here today introduced a new platen for its 200-mm wafer chemical mechanical planarization (CMP) system designed to extend reliable control of polishing processes ...
Nature

Oxidation differences on Si- versus C-terminated surfaces of SiC during planarization in the fabrication of high-power, high-frequency semiconductor device

Silicon carbide (SiC) wafers have attracted attention as a material for advanced power semiconductor device applications due to their high bandgap and stability at high temperatures and voltages.
AZOM

Using 3D Optical Profiling for Full-Field Hotspot Detection

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...
AZOM

Enhancing Chemical Mechanical Planarization (CMP) Yield Through Multivariable Process Monitoring

Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...
Electronic Design

Leti and CMP announce multiproject wafer service with integrated silicon OxRAM

Grenoble, France. Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the industry’s first ...
The Desert Sun

SiC Wafer Processing Market Expansion Accelerates, Projected to Reach US$ 2,986.44 Million by 2032

This will expand the role of advanced CMP consumables, high-precision metrology, and contamination control. Epi wafers gain strategic value As device architectures become more demanding, epi quality ...
Business Insider

REVASUM (ASX:RVS) announces the release of a 200mm conversion kit for their flagship 6EZ silicon carbide (SiC) chemical mechanical polishing (CMP) platform

SAN LUIS OBISPO, Calif., July 6, 2023 /PRNewswire/ -- Revasum today announced the availability of 200mm SiC wafer polishing capability on their 6EZ chemical mechanical polishing platform. The 6EZ has ...