In addition to surface and subsurface defects, residual stress represents a concern. Over time, these stress points, ...

Solid state image sensors require protection from the ambient atmosphere. First-generation imagers were housed in standard semiconductor packages with glass lids. These were hermetic and delivered ...

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...

Kulicke & Soffa Industries Inc. (K&S) today announced that Amkor Technology Inc. of Chandler, Ariz., will license its wafer level packaging technology from Flip Chip Technologies LLC (FCT) for its ...